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Amkor Adds Latest Packaging Equipment to Advanced Prototype Development Lab
CHANDLER, Ariz.----Oct. 17, 2000--To meet increased
customer focus on advanced flip chip and system-in-package production,
Amkor Technology (Nasdaq: AMKR) has added the latest equipment from
several manufacturers to its expanding prototype package development
lab here.
The lab, which opened last year to assist U.S.-based semiconductor
companies with local development of advanced packages, has been
expanded to include the newest systems for ball attach, wire bond and
die attach processes.
``The lab was developed to ensure that our customers move from
concept to production in the shortest possible time,'' said Jonathon
Greenwood, senior director of Amkor's Advanced Package Development
Center. ``In combination with our adjacent design center, the lab
specializes in reducing the time between concept and delivery for
advanced flip chip and system-in-package ICs, which is a major
advantage for customers.
``Amkor has invested in the lab equipment and technology to ensure
that we continue to be technology leaders and to assure customers that
their products are reliable, cost efficient and can be manufactured in
high volumes with the greatest potential for success,'' Greenwood said.
In addition to advanced and traditional packaging equipment, the
expanded laboratory operates one of the first laser solder ball
attachment systems in service. The system, a Kulicke and Soffa 9388
Laser Pro, uses a laser for solder reflow at rates up to 30 balls per
second and accuracy of 5 microns. Also added are two high-speed,
fine-pitch K&S 8028 wire bond systems with bonding speeds in excess of
10 wires per second at 60 micron in-line bond pad pitch. A third
system, a Datacon APM flip chip die attach system, is capable of 10
micron placement repeatability at 3 sigma.
``Our goal is to provide customers with high quality prototypes in
a very short cycle time once the design and materials are received,''
said Steve Shermer, operations director for the center. ``By locating
the lab in Arizona, we can sharply reduce development time on these
new technologies. We offer some of the most advanced prototype
packaging capabilities in the United States.''
To further the speed time to production, all package data,
including production processes, reliability reports, drawings,
equipment process programs and other manufacturing information, can be
transmitted electronically from the lab in Arizona to Amkor production
facilities in Korea and the Philippines.
About Amkor Technology: Amkor Technology, Inc. is the world's
largest provider of contract microelectronics manufacturing solutions.
The company offers semiconductor companies and electronics OEMs a
complete set of microelectronic design and manufacturing services,
including deep sub-micron wafer fabrication; wafer probe, wafer
mapping, characterization and reliability testing; IC packaging design
and assembly; multi-chip module design and assembly; and final
testing. More information on Amkor is available from the company's SEC
filings and on Amkor's web site: www.amkor.com.
Editors: Photographs of the lab and equipment are available at:
http://www.amkor.com/PR101700_APDC/index.htm
2000-28 10/17/00 AMKOR ADDS LATEST PACKAGING EQUIPMENT TO ADVANCED
PROTOTYPE DEVELOPMENT LAB
Contact:
Amkor Technology, Inc.
Director -- Communications
Ken Jensen, 480/821-2408 Ext. 5130
kjens@amkor.com
VP Investor Relations
Jeffrey Luth, 610/431-9600
jluth@amkor.com
or
KVO Public Relations
Don Tuite, 650/961-1551
don_tuite@kvo.com
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